Leaked list of Next Generation iPhone component providers?
April 16, 2009 | Tim Bradbury
DigiTimes, the same site that originally reported Apple’s purchase of 3.2 megapixel cameras, recently released what appears to be a list outlining the component suppliers for the Next Generation iPhone. While this list certainly brings very little new information to the table, it does however, somewhat confirm that the Next Generation iPhone will have a 3.2 megapixel camera, a huge step up from the current 2 megapixel camera.
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Apple next-generation iPhone: Chip and key component suppliers |
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Item |
Supplier |
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NAND flash |
Samsung, Toshiba |
|
Mobile DDR DRAM |
Samsung |
|
NOR flash |
Numonyx |
|
Serial flash |
Silicon Storage Technology (SST) |
|
WCDMA power amplifier |
TriQuint |
|
GSM EDGA power amplifier |
Skyworks |
|
Baseband |
Infineon |
|
A-GPS |
Infineon |
|
Bluetooth |
CSR |
|
3.2-megapixel CIS |
OmniVision |
|
Power management IC |
Infineon, NXP |
|
SAW (surface acoustic wave) filter |
TXC |
|
Connector |
Foxlink |
|
PCB |
Unimicron, Nanya PCB |
|
Camera |
Largan Precision |
Source: Industry sources in Taiwan, compiled by Digitimes, April 2009
Please note that this list is by no means official and has not been confirmed by any official Apple sources.
